SEMICONDUCTOR INDUSTRY
Inspection Products
Various types of wafer, wirebond, substrate, die attached, pallet, leadframe, tape and reel and PCB components
Inspection Features
Colour, Mono and SWIR Inspection (Inner layer)
Colour Camera
Mono Camera
SWIR Camera
Line Scan Inspection
Suitable for long piece, continuous objects Inspection. EG: Leadframe package inspection or tape and reel inspection
Area Scan Inspection
Suitable for one individual objects inspection
Inspection Capabilities
Package Inspection
Rough Surface
Void
Package Scratches
Incomplete Fill
Crown Flash
ID pin Height
Chip on Package
Raised Flag
Package Offset
Foreign Material
Pin 1 Chip
Flash on EP
Inspection Capabilities
Tape & Reel Inspection
Scratch
Chip Out
Wrong Marking
Wrong Orientation
Foreign Material
